Accelerated Reliability Test Method of Thermal Cycle Life for Solder Joints of Electronic Devices
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Journal of the Society of Materials Science, Japan
سال: 2004
ISSN: 1880-7488,0514-5163
DOI: 10.2472/jsms.53.218